Page 11 - smartWLI cutting tools

application which requires sub micrometer xy resolution

REM image smartWLI – 3D Scan / 100x

camera image 100x objektive color coded 3D image/ partial area 3.5 x 2.3 µm²

Sub micrometer structures of an grid on an wafer edge. The 3d scan using the white-light interferometer of an smartWLI
sensor shows much higher resolution compared with the optical image of an 100x objective. The electron microscope has
higher resolution and shows material specific contrast – but without the ability to provide 3D data.