polished wafer surface
The smartWLI’s can measure larger areas with atomic height resolution.
Objectives from 2.5x … 100x allow various tasks from the flatness measurement to the evaluation of the micro roughness. The scanning of app. 100 mio. measuring points can be done in less than 3 minutes.
The video shows the surface roughness of a polished wafer and a grind wafer surface with a magnified presentation of a partial area.